半導體製造技術

臺北科技大學 115-1 學期課程，課號 366375。

課程大綱

1.Introduction to Semiconductor Engineering 2.Semiconductor Fundamental & Advanced 3D CMOS Process 3.Wafer Manufacturing 4.Cleanroom, Clean and Gettering 5.Thermal Oxidation 6.Diffusion 7.Ion Implantation 8.Etching 9.Deposition 10.Lithography 11.The Shift From 2D to 3D Semiconductor Technology

課程進度

單元主題 1.Introduction to Semiconductor Engineering 2.Semiconductor Fundamental & Advanced 3D CMOS Process 3.Wafer Manufacturing 4.Cleanroom, Clearn and Gettering 5.Thermal Oxidation 6.Diffusion 7.Ion Implantation 8.Etching 9.Deposition 10.Lithography 11.The Shift From 2D to 3D Semiconductor Technology TCAD Simulation Practice Final Project

評量方式

Attendance (10%) Exam (35%) Final Project (50%) Flexible Learning (5%)

教材

【遵守智慧財產權觀念，請使用正版教科書，不得使用非法影印教科書】 使用外文原文書：是 [1] James D. Plummer, M. D. Deal, and P. B. Griffin, “Silicon VLSI Technology-Fundamentals, Practice and Modeling”, 2000, Prentice Hall. [2] 吳永俊, “半導體製程與整合”, 滄海圖書 [3] Hong Xiao, “Introduction to Semiconductor Manufacturing Technology”, Prentice Hall [4]Stanley Wolf and Richard N. Tauber “Silicon Processing for the VLSI ERA, Volume1: Process Technology”, 1986, Lattice Press. [5] W. R. Runyan and K. E. Bean “Semiconductor Integrated Circuit Processing Technology”, 1990, Addison-Wesley. [6] James W. Mayer and Sylvanus S. Lau “Electronic Materials Science: For Integrated Circuits in SI and GaAs”, 1989, Prentice Hall.