封裝技術

臺北科技大學 115-1 學期課程，課號 363920。

課程大綱

This course will teach the fundamentals for packaging, including phase diagrams of solders, bonding technology, metallurgical reactions, and reliabilities, as well as the state-of-the-art Cu-Cu hybrid bonding. It will also cover bonding technology of microelectronic packaging: Die Attach/Chip Bond, Wire Bond, Tape automatic bonding, Flip Chip Technology, Pb-based and Pb-free Solders, Microbumps, 3D IC packaging, Cu-Cu bonding, and Cu hybrid bonding. Metallurgical reactions include Cu-Sn, Ni-Sn, Sn-Au, Ag-Sn, Pd-Sn, and In-Sn. The following reliability issues will be taught: multiple reflow, electromigration, thermomigration, Stress, temperature cycling tests, solid state aging, Sn whisker, and Mean-time-to-failure measurement.

課程進度

The teacher expects each chapter to be finished weekly. 1st Introduction: Phase diagrams, 2nd handout: Chip-level interconnection-Wire bonding 2nd Wire bonding, 3rd handout: Die attach & Leadframe, 4th TAB; Surface Finishes 5th Metallurgical Reaction (I) bulk samples 6th Metallurgical Reaction (II) Thin Films & FCT Reliability 7th Pb-based and Pb-free solders, 8th Metallurgical Reaction (III); 8th Reliability Issues of Pb-free Solder Joints, 9th Metallurgical Reaction (IV): 9th Cross reactions and massive spalling 10th Metallurgical Reaction (V): 10th Effect of Solder Volume on Metallurgical 11th reactions and reliabilities of solder joints/microbumps. 12th Electromigration I: EM in Al, Cu and Solder lines 13th Electromigration II: EM in Solder joints; Electromigration III: Void formation, current and temperature redistribution. 14th Thermomigration 15th Advanced packaging. EM & TM in microbumps; 16th 3D IC Packaging; Cu-Cu bonding. 16th 3D IC Packaging; Cu-Cu bonding. 17th 3D IC Packaging; Cu/SiO2 hybrid bonding. 18th 3D IC Packaging; Cu/ SiO2 hybrid bonding.

評量方式

Midterm: 30% Class Attendance: 20% Term paper, Journal paper critique: 30% Final: 20%

教材

【遵守智慧財產權觀念，請使用正版教科書，不得使用非法影印教科書】 使用外文原文書：否 1. K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging Science and Engineering, Wiley 2021. 2. K. N. Tu, Solder Joint Technology: Materials, Properties, and Reliability (Springer 2007)