半導體製程技術

臺北科技大學 115-1 學期課程，課號 362710。

課程大綱

導論、積體電路生產介紹、半導體基礎、晶圓製造、加熱製程、微影蝕刻、電漿的基礎原理、離子佈植、化學氣相沉積與介電質薄膜、金屬化製程、化學機械研磨、製程整合、CMOS製程 Introduction、Introduction to IC Fabrication、Semiconductor Basics、 Wafer Manufacturing、Thermal Processes、Photolithography and Etch、 Plasma Basics、Ion Implantation、CVD and Dielectric Thin Film、 Metallization、CMP 、Process Integration、CMOS Processes

課程進度

Week 1 Opening of lecture/Introduction Week 2 Introduction to Integrated Circuit (IC) Week 3 Crystal Structure and Physical Properties of Silicon Semiconductors Week 4 Semiconductor Energy Bands and Carrier Transport Week 5 Semiconductor basic components Week 6 Electrodeposition and Electromigration in Interconnects Week 7 Integrated circuit fabrication and layout Week 8 Wafer processing Week 9 Midterm exam Week 10 Photolithography Week 11 Wafer Etching, Chemical-Mechanical Polishing Week 13 Silicon ingot manufacturing, Silicon epitaxial growth Week 14 Diffusion process, Ion implantation, Annealing Week 15 IC Packaging Technology and testing Week 16 Final Exam Week 17 Lab visiting Week 18 Lab visiting

評量方式

Midterm: 25% Class Attendance: 20% Term paper, Journal paper critique: 30% Final: 25%

教材

【遵守智慧財產權觀念，請使用正版教科書，不得使用非法影印教科書】 使用外文原文書：否 1. Introduction To Semiconductor Manufacturing Processes Fourth Edition Li Kejun Li Kehui Li Mingku 2. K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging, Science and Engineering, Wiley 2021.