系統級封裝之雛型設計與應用

臺北科技大學 114-2 學期課程，課號 359774。

課程大綱

System packaging employs multilayer structures to provide power to chips. However, power delivery networks are affected by factors such as parallel-plate resonance and switching noise resulting from coupling between parallel plates and transmission lines, which can cause power integrity issues. This course will introduce the causes of the aforementioned problems from an electromagnetic field perspective and utilize circuit theory to establish models and perform simulation analysis. Finally, improved design methods will be introduced through practical examples to enhance the power quality of power distribution networks. This enables understanding of analog circuit design and integrated system packaging for power and signal design, thereby establishing a foundation for the research and development of high-speed digital systems. 系統構裝使用多層結構提供晶片電源，然而，電源遞送網路會受到平板共振、以及平板與傳輸線耦合的切換雜訊等因素影響，造成電源完整度的問題。本課程將從電磁場的角度介紹上述問題的成因，並利用電路的理論進行模型的建立及模擬分析，最後且以實例介紹改良設計方法，使電源分佈網路的電源品質可以改善，以了解類比電路設計及整合系統構裝的電源及訊號設計，進而建立研發高速數位系統的基礎。

課程進度

Week 1.Introduction Week 2.Fundamental Issues of Power Integrity. Week 3.Fundamental Issues of Power Integrity. Week 4.Power Delivery Network (PDN) Components and Basic Design. Week 5.Power Delivery Network (PDN) Components and Basic Design. Week 6.Analysis and Measurement of PDN. Week 7.Analysis and Measurement of PDN. Week 8.Circuit Modeling of Planes Week 9.Circuit Modeling of Planes Week 10.Midterm Week 11.Modeling of Multiple Plane Pairs Week 12.Modeling of Multiple Plane Pairs Week 13.Modeling for Tx-Lines and Planes for Simultaneous Switching Noise Week 14.Modeling for Tx-Lines and Planes for Simultaneous Switching Noise Week 15.Time-Domain Simulation: Macro-modeling Week 16.Time-Domain Simulation: Macro-modeling Week 17.Time-Domain Simulation by Convolution Week 18.Time-Domain Simulation by Convolution

評量方式

Homework: 40% Midterm: 30% Final Project Report: 30% The above grading criteria may change depending on the number of enrolled students.

教材

【遵守智慧財產權觀念，請使用正版教科書，不得使用非法影印教科書】 使用外文原文書：是 Textbook: 1. Power integrity modeling and design for semiconductors and systems. Reference: 2. Power Distribution Network Design Methodology