半導體製程整合技術

臺北科技大學 114-2 學期課程，課號 359728。

課程大綱

本課程係將整合個別半導體製造單元，併同現有半導體產業與未來發展趨勢的分析介紹，再輔以積體電路元件的設計原理，期使學生具備從製程、設備、元件原理等各方面獲得半導體製程的整合性觀念。 In this class, the semiconductor fabrication process is treated as a set of specified units. Incorporating the semiconductor industry and its future development trends, the knowledge of semiconductor theory and the fabrication details of each unit were integrated. The students will acquire comprehensive knowledge of semiconductor fabrication processes and device theories.

課程進度

(1) Semiconductor Industry overview (2)(3) IC Fundamentals/ IC Design (4) Fabrication of Si Wafer (5) (6) Chemical Vapor Deposition (7) (8) Physical Vapor Deposition (9) Mid-term examination (10) (11) Doping technology (thermal and ion implantation) (12) (13) Photolithograph (14) (15) Characterization techniques for semiconductor material properties (16) (17) IC Testing techniques (18) Final examination

評量方式

45% Midterm exam 45% Final examination 10% Quiz and Reports

教材

【遵守智慧財產權觀念，請使用正版教科書，不得使用非法影印教科書】 使用外文原文書：是 Text books: (1) Semiconductor Devices: Physics and Technology, 3rd Edition, Simon M. Sze, Ming-Kwei Lee (2) Semiconductor Manufacturing Technology, Prentice Hall, 1st edition (November 19, 2000), Michael Quirk