半導體構裝技術

臺北科技大學 114-2 學期課程，課號 359693。

課程大綱

半導體構裝技術是將積體電路和其它電元件，依設計聯結在一系統中，再以構裝材料將晶片、基座及釘架封包。本課程將介紹陶瓷構裝和高分子構裝、及其相關技術、與工業現況。 Semiconductor packaging facilitates the chips be incorporated into an individual protective package, mounted with other components in hybrid or multi-chip modules, or connected directly onto a printed circuit board. This course will introduce both ceramic packaging and polymer packaging and their corresponding technology. It covers the topics in any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection, and radiation heat transfer; thermo-mechanical failures and reliability; advanced packaging materials at micro and nano-scales; ceramic, organic, glass, and silicon substrates.

課程進度

Week 1-2 Microelectronics Packaging—An Overview Week 3-5 Ceramic packaging Week 6-8 Polymers in packaging Week 9 Mid-term examination Week 10-12 Thin-film packaging Week 13-15 Package Sealing and Encapsulation Week 16-17 Advanced packaging in micro and nanoscales Week 18 Final examination

評量方式

Mid-term examination 50% Fianl examination 50%

教材

【遵守智慧財產權觀念，請使用正版教科書，不得使用非法影印教科書】 使用外文原文書：是 1. Fundamentals of Microsystems Packaging, Tummala, Rao, 2018 (2nd ed) 2. Microelectronics Packaging Handbook: semiconductor packaging, Tummala, Rao, Rymaszewski, Eugene J., Klopfenstein, Alan G., 1997