半導體製程技術導論

臺北科技大學 114-2 學期課程,課號 357217。

課程大綱

導論、積體電路生產介紹、半導體基礎、晶圓製造、加熱製程、微影蝕刻、電漿的基礎原理、離子佈植、化學氣相沉積與介電質薄膜、金屬化製程、化學機械研磨、製程整合、CMOS 製程 Introduction、Introduction to IC Fabrication、Semiconductor Basics、 Wafer Manufacturing、Thermal Processes、Photolithography and Etch、 Plasma Basics、Ion Implantation、CVD and Dielectric Thin Film、 Metallization、CMP 、Process Integration、CMOS Processes

課程進度

Introduction to IC Fabrication ( 1 week ) Semiconductor Basics ( 2 weeks ) Wafer Manufacturing ( 1 week ) Thermal Processes ( 2 weeks ) Photolithography and Etch ( 1 week ) Plasma Basics ( 2 weeks ) Ion Implantation ( 1 week ) CVD and Dielectric Thin Film ( 2 weeks ) Metallization ( 1 week ) CMP ( 1 week ) Process Integration ( 1 week ) CMOS Processes ( 1 week )

評量方式

Attendance : 25 % Midterm: 25 % ( close book ) Final term:30 % (close book ) Presentation:20 % (7-10 minutes presentation per person) (Based on how many students attend in this semester)

教材

【遵守智慧財產權觀念,請使用正版教科書,不得使用非法影印教科書】 使用外文原文書:是 Introduction to semiconductor manufacturing technology