半導體材料

臺北科技大學 114-2 學期課程，課號 357079。

• 學期：114-2
• 授課教師：許穎超
• 學分：3
• 選修
• 上課時段：週三 7、8 節；週四 9 節

課程大綱

本課程主要是介紹括半導體產業概述, 半導體元件基礎, 半導體元件與後段製造技術與設備, 元件電性分析與量測與 半導體封裝。 This course mainly introduce on semiconductor materials and fabrication technology: 1. Overview of semiconductor industry and circuit componenet introduction 2. Semiconductor fundamental (materials, device physics and application) 3. Front End of Line (FEOL) Technology 4. Backend of Line (BEOL) Technology 5. Crystal growth , basic properties of Silicon Wafer 6. Introduce 7 principle fabrication modules: Photo lithography, film deposiotn, etch, clean, CMP, Diffution and process integration 7. Introduce device electricl test 8. Semiconductor packaging

課程進度

1. WK1-2: Overview of semiconductor industry and circuit componenet introduction 2. WK3-5: Semiconductor fundamental 3.WK6-7: Front End of Line (FEOL) Technology 4. WK8: Course review & Midterm examination 5. WK9-10: Backend of Line (BEOL) Technology 6. WK11-12: Crystal growth , basic properties of Silicon Wafer 7. WK 13-15: Introduce 7 principle fabrication modules 8. WK16: Introduce device electricl test 9. WK17: Semiconductor packaging 10: WK18: Course review & Midterm examination

評量方式

出席率 : 10% (請假請預先告知) 測驗-1 (Week 5): 15% 期中考 (Week 9): 15% 測驗-2 (Week 14): 15% 期末考 (Week 18): 35% 討論Q&A: 10% (1Q +1分, 上限10分) 通知補考(補考者學期末最高成績:70分)

教材

【遵守智慧財產權觀念，請使用正版教科書，不得使用非法影印教科書】 使用外文原文書：否 使用自編教材 / Use of self-made materials