高等IC製程

臺北科技大學 114-2 學期課程,課號 356188。

課程大綱

Study the state of the art of the IC fabrication processes, including heating, ion implant, PVD, CVD, lithograph, etching of the front-end processes and packaging and testing of back-end processes. The trends of the processes, the relationship of the processes with the physics of the devices and the process integrating technology will also be taught in this course. The fundamentals for advanced semiconductor packaging will be provided.

課程進度

The teacher expects each chapter to be finished weekly, but the schedule is flexible.

評量方式

Midterm: 25% Class Attendance: 20% Term paper, Journal paper critique (2): 30% Final: 25%

教材

【遵守智慧財產權觀念,請使用正版教科書,不得使用非法影印教科書】 使用外文原文書:否 K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging, Science and Engineering, Wiley 2021.