半導體製程

臺北科技大學 114-2 學期課程，課號 354431。

課程大綱

1.Introduction to Semiconductor Engineering 2.Semiconductor Fundamental 3.Wafer Manufacturing 4.Cleanroom, Clearn and Gettering 5.Thermal Oxidation 6.Diffusion 7.Ion Implantation 8.Etching 9.Deposition 10.Lithography

課程進度

1.Introduction to Semiconductor Engineering 2.Semiconductor Fundamental 3.Semiconductor Fundamental 4.Wafer Manufacturing 5.Cleanroom, Clearn and Gettering 6.Thermal Oxidation 7.Diffusion 8.Ion Implantation 9.Mid-term Exam 10.Etching 11.Deposition 12.Lithography 13.Lithography 14.上機實習 15.上機實習 16.上機實習 17.Final Exam 18.Final Project

評量方式

Attendance (20%) Exam (35%) Final Project (45%)

教材

【遵守智慧財產權觀念，請使用正版教科書，不得使用非法影印教科書】 使用外文原文書：是 Textbook: [1]蕭宏, “半導體製程技術導論”, 全華圖書第五版, 2025/07 (譯自第三版初稿) [2]吳永俊, “半導體製程與整合”, 滄海圖書, 2023/10 Reference: [1] Hong Xiao, “Introduction to Semiconductor Manufacturing Technology, 2nd Edition”, 2012, Prentice Hall. (英文書第三版尚未出版) [2] James D. Plummer, M. D. Deal, and P. B. Griffin, “Silicon VLSI Technology-Fundamentals, Practice and Modeling”, 2000, Prentice Hall. [3] Stanley Wolf and Richard N. Tauber “Silicon Processing for the VLSI ERA, Volume1: Process Technology”, 1986, Lattice Press. [4] W. R. Runyan and K. E. Bean “Semiconductor Integrated Circuit Processing Technology”, 1990, Addison-Wesley. [5] James W. Mayer and Sylvanus S. Lau “Electronic Materials Science: For Integrated Circuits in SI and GaAs”, 1989, Prentice Hall.